In today’s world of improved technology the electronic components are found almost in every systematic device as from the computer systems to the normal garage door. Basically these electronic components are mounted on the printed circuit board which is being enclosed by the polycarbonat gehäuse or any casing devices. These electronic oriented components used to produce heat while they have been used by the day to day devices. Hence this heat might be damaging the life span of these electronic components due to their heavier temperatures. Hence in order to save guard these components the several manufacturing companies have been developing many ABS gehäuse enclosures in order to prevent them. In order to make the cool based enclosures one have to follow the below basic suggestions. As an initial step you have to increase the gap in between the electronic components and the casing. Basically the heat might be raised even in the situation with only smaller space. One can get rid of these higher temperatures by developing the elektronikgehäuse which ought to include the more spacious that helps to prevent the components by diverting the heat away from the electronic components and there by maintaining them to be in cooler position. As a next step you have to widen the space in between each component. But in today’s developed technological world the complex electronic devices tend to made in a highly compactable manner and hence the highly packed components tend to produce more heat. The generation of heat depends upon the capacity of air flow in between the electronic components and the casing. Hence by increasing the spaces in between the devices might help these components to be cooler. Next you have to include certain air flow by providing ventilating facility at the bottom and top of casing. This ventilating might be supplying the device with enough air flow which might be removing the heat from the bottom and top of the device. Then you can install certain screening components on the opening of the electronic device. Even the dust materials might be disturbing the components since these dust particles might be developing the smaller force of magnetization that may harm the devices. Over more time period of these dust settlement they may change into blanket on the components which later make the heat generation of the components.